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Product description > > Non-Destructive Wafer Inspection System
Non-Destructive Wafer Inspection
| Tool Specifications | 1360 mm(w) x 2750 mm (d) x 2200mm (h) |
|---|---|
| Vacuum | 20in - Hg, 1.0 SCFM, minimum |
| Electric Power | 180 - 265VAC, 48-62Hz, 1-phase, 30A Service |
| Pressurized Air | 600 kPa to 700 kPa at 20 lpm or more |
| Safety | IBC compatible seismic anchorage |
| Light Source | High power 780nm fiber femtosecond laser |
Product details
✔ Non-Destructive Option Technique
✔ Sensitive Non Visual Defect Detection
✔ High in-line Throughput 20-30WPH+
✔ Character Surface and Buried Interfaces
✔ Easy to Use and Interpret Software
