- Hanmi Semiconductor System
- 당사는 보다 앞선 기술 정보와 제품을 발굴하여 최고의 제품기술,정보 및 서비스를 위해 항상 최선을 다하겠습니다.
제품소개 > Hanmi Semiconductor System > META GRINDER
META GRINDER
제품상세정보
Grinding
Accuracy : +/-5μm (DSM BGA)
TTV:
＜5μm(DSM BGA)
SPH
: 84 Strips (EMC 40μm , 1point)
3
Spindle (Rough / Fine / Polish)
Automatic
Wheel Dressing
Grinding
Concept : Cup type (EMC + Ball + Die)
Height
Check : Touch Probe Sensor (Repeatability ±1μm)
Spindle
Max RPM: 2,500 (Rated Torque 6.0N.m at 500~6,000rpm)
Z
axis : Max 40mm/s
Anti
Vibration Linear way
High
pressure Water Pump for Wheel Cleaning Nozzle
Feed
Speed Max : 200mm/s
Motion
Flatness error range : 5μm
Anti
Vibration Linear way